John Crofton, Murray State University; James Rogers, Murray State University; Caitlin Pugh, University of Kentucky; Kenny Evans, University of Kentucky
Ali Mazloomzadeh, Florida International University; Mustafa Farhadi, Florida International University; Osama A. Mohammed, Florida International University
Jia-Ling Lin, University of Minnesota, Twin Cities; Paul Imbertson, University of Minnesota, Twin Cities; Tamara J Moore, University of Minnesota, Twin Cities
Stanley W. Hsu, University of California, Davis; Rajeevan Amirtharajah, University of California, Davis; andre knoesen, Department of Electrical and Computer Engineering, U C Davis
Mircea Alexandru Dabacan, Technical University of Cluj-Napoca; Clint S. Cole, Digilent, Inc.; Mihaela Radu, Rose-Hulman Institute of Technology; Joe Harris, Digilent, Inc.; Alex DUPE Wong; Monica Bot
Aharon Gero, Technion - Israel Institute of Technology; Wishah Zoabi, Technion – Israel Institute of Technology; Nissim Sabag, Ort Braude College of Engineering
joshua fabian, Villanova University; Tyler A. Young, Villanova University; James Peyton Jones, Villanova University; Garrett Miles Clayton, Villanova University
Kenneth A. Connor, Rensselaer Polytechnic Institute; Dianna L. Newman, University at Albany/SUNY; Meghan Morris Deyoe, University at Albany/SUNY; Craig J. Scott, Morgan State University; Mohamed F. Chouikha, Howard University; Yacob Astatke, Morgan State University
Berenice Verdin, University of Texas at El Paso; Ricardo Von Borries, University of Texas, El Paso; Patricia A. Nava P.E., University of Texas, El Paso; Andrew C. Butler, Duke University
Dale N. Buechler, University of Wisconsin, Platteville; Phil J. Sealy, University of Wisconsin, Platteville; John Goomey, University of Wisconsin, Platteville
Esteban Rodriguez-Marek, Eastern Washington University; Min-Sung Koh, Eastern Washington University; Claudio Talarico, Eastern Washington University; Jabulani Nyathi, Eastern Washington University
Jayaraman J.Thiagarajan, Arizona State University; Raja Ayyanar, Arizona State University; Andreas S. Spanias, Arizona State University, ECEE, SenSIP Center
Jianbiao Pan, California Polytechnic State University; Albert Liddicoat, California Polytechnic State University; James Harris, California Polytechnic State University; Linda Shepherd, California Polytechnic State University