Siddhant Joshi, Purdue University at West Lafayette (COE); Kirsten Davis, Purdue University at West Lafayette (COE); Lori Czerwionka, Purdue University at West Lafayette (PPI); Elisa Camps Troncoso, Purdue University at West Lafayette (PPI); Francisco Montalvo
Systems Engineering Division (SYS) Technical Session 1
Collection
2023 ASEE Annual Conference & Exposition
Authors
Amy Thompson, University of Connecticut; Matthew D. Stuber, University of Connecticut; Song Han, University of Connecticut; Abhishek Dutta, University of Connecticut; Hongyi Xu, University of Connecticut; Shengli Zhou, University of Connecticut; Qian Yang, University of Connecticut; Fei Miao, University of Connecticut; George M. Bollas, University of Connecticut
Systems Engineering Division (SYS) Technical Session 1
Collection
2023 ASEE Annual Conference & Exposition
Authors
Rachel Brennan, Tufts University; Mohammed Tonkal, Tufts University and King Abdulaziz University, Saudi Arabia; Chris Buergin Rogers, Tufts University
Henry Lester, University of Dayton; Kellie Schneider, University of Dayton; Corinne Mowrey, University of Dayton; Raymond Smith, East Carolina University
Kelley E. Dugan, University of Michigan; Erika A. Mosyjowski, University of Michigan; Shanna R. Daly, University of Michigan; Lisa R. Lattuca, University of Michigan
Tahsin Mahmud Chowdhury, Virginia Polytechnic Institute and State University; Sreyoshi Bhaduri, McGraw Hill ; Homero Murzi, Virginia Polytechnic Institute and State University
Marsha Lovett, Carnegie Mellon University; Mark David Bedillion, Carnegie Mellon University; Cassandra M. Birrenkott, South Dakota School of Mines and Technology; Karim Heinz Muci-Kuchler, South Dakota School of Mines and Technology; Laura Ochs Pottmeyer, Carnegie Mellon University
Cassandra M. Birrenkott, South Dakota School of Mines and Technology; Karim Heinz Muci-Kuchler, South Dakota School of Mines and Technology; Mark David Bedillion, Carnegie Mellon University; Marsha Lovett, Carnegie Mellon University; Laura Ochs Pottmeyer, Carnegie Mellon University
Mark David Bedillion, Carnegie Mellon University; Karim Heinz Muci-Kuchler, South Dakota School of Mines and Technology; Cassandra M. Birrenkott, South Dakota School of Mines and Technology; Marsha Lovett, Carnegie Mellon University; Laura Ochs Pottmeyer, Carnegie Mellon University
Microprocessor, Microcontrollers, and Embedded Systems Education
Collection
2015 ASEE Annual Conference & Exposition
Authors
Mason Marshall, Missouri University of Science and Technology; Ariel Moss, Missouri S&T; Larry Gene Garringer, Missouri S&T; Rohit Dua, Missouri University of Science & Technology
Innovations in Communications and Wireless Systems Education
Collection
2015 ASEE Annual Conference & Exposition
Authors
Vuk Marojevic, Virginia Tech; Richard M. Goff, Virginia Tech Department of Engineering Education; Carl B Dietrich P.E., Bradley Department of Electrical and Computer Engineering, Virginia Tech; Taeyoung Yang, Virginia Tech; Christian W. Hearn, Weber State University; Nicholas F Polys, Virginia Tech Advanced Research Computing; R. Michael Buehrer, Virginia Tech
Samuel Lakeou, University of the District of Columbia; Esther Ososanya, University of the District of Columbia; Ben Latigo, University of the District of Columbia; Sisay Beru, University of the District of Columbia; Mamadou Keita, University of the District of Columbia; Steven Omoijunanfo, University of the District of Columbia
Donald Keating, University of South Carolina; Thomas Stanford, University of South Carolina; John Bardo, Western Carolina University; Duane Dunlap, Western Carolina University; Dennis Depew, Purdue University; Niaz Latif, Purdue University; Gary Bertoline, Purdue University; Stephen Tricamo, New Jersey Institute of Technology; Harvey Palmer, Rochester Institute of Technology; Albert McHenry, Arizona State University; Eugene DeLoatch, Morgan State University; Mohammad Noori, California State Polytechnic; Ronald Bennett, University of St. Thomas; Jay Snellenberger, Rolls-Royce; Samuel Truesdale, Rolls-Royce
Dennis Depew, Purdue University; Niaz Latif, Purdue University; Gary Bertoline, Purdue University; Donald Keating, University of South Carolina; Thomas Stanford, University of South Carolina; Stephen Tricamo, New Jersey Institute of Technology; Duane Dunlap, Western Carolina University; Albert McHenry, Arizona State University; Harvey Palmer, Rochester Institute of Technology; Eugene DeLoatch, Morgan State University; Ronald Bennett, University of St. Thomas; Mohammad Noori, California State Polytechnic University; Jay Snellenberger, Rolls-Royce; Samuel Truesdale, Rolls-Royce