Fred Meyer, United States Military Academy; christopher conley, United States Military Academy; Scott Hamilton, United States Military Academy; Joseph Hanus, United States Military Academy; Steven Hart, United States Military Academy; James Ledlie Klosky, United States Military Academy
Brock E. Barry, U.S. Military Academy; Maj Jonathan Bodenhamer, U.S. Military Academy, Department of Civil and Mechanical Engineering; James J O'Brien Jr., American Society of Civil Engineers
Shawn S. Jordan, Arizona State University; Odesma Onika Dalrymple, Arizona State University, Polytechnic; Nielsen L. Pereira, Western Kentucky University; Yacob Astatke, Morgan State University; Jerry-Daryl Fletcher, Morgan State University
Lawrence Holloway, University of Kentucky; Yang-Tse Cheng, University of Kentucky; Donald G. Colliver P.E., University of Kentucky; Aaron Cramer, University of Kentucky; Paul A. Dolloff, University of Kentucky; Bob Gregory, University of Kentucky; John George Groppo Jr., University of Kentucky; Yuan Liao, University of Kentucky; Stephen M. Lipka, University of Kentucky; Jim Neathery, Unversity of Kentucky; Johne M. Parker, University of Kentucky; Vijay Singh, University of Kentucky; Joseph Sottile, University of Kentucky; Timothy R.B. Taylor P.E., University of Kentucky; Rodney Andrews, University of Kentucky
Harold T. Evensen, University of Wisconsin, Platteville; Osama M. Jadaan, University of Mount Union; Tsunghsueh Wu, University of Wisconsin, Platteville; Yan Wu, University of Wisconsin, Platteville; Esther N. Ofulue
Kristin L. Wood, University of Texas, Austin; Rajesh Elara Mohan, Singapore University of Technology and Design; Sawako Kaijima, Singapore University of Technology and Design; Stylianos Dritsas, Singapore University of Technology and Design; Daniel D. Frey, Massachusetts Institute of Technology; Christina Kay White, University of Texas, Austin; Daniel D. Jensen, U.S. Air Force Academy; Richard H. Crawford, University of Texas, Austin; Diana Moreno, Singapore University of Technology and Design; Kin-Leong Pey, Singapore University of Technology and Design