Peter L Schmidt, University of North Carolina, Charlotte; Daniel Hoch, University of North Carolina, Charlotte; Nabila A. Bousaba, University of North Carolina, Charlotte; William F. Heybruck, University of North Carolina, Charlotte; Deborah L Sharer, University of North Carolina, Charlotte; Valentina Cecchi, University of North Carolina at Charlotte; Gary Teng, University of North Carolina at Charlotte; Elizabeth Sharer, Francis Marion University
Karen Wosczyna-Birch, CT College of Technology and the Regional Center for Next Generation Manufacturing; Wesley Francillon, Ph.D., Connectiuct Community College; John Birch, The Birch Group, LLC
Xiaobin Le, Wentworth Institute of Technology ; Anthony William Duva, Wentworth Institute of Technology; Richard L. Roberts, Wentworth Institute of Technology; Ali R. Moazed, Wentworth Institute of Technology
Juan C. Ordonez, Florida State University; Jose Vargas, Universidade Federal do Parana; Chiang Shih, Florida A&M University/Florida State University; Necesio Gomes Costa, Universidade Federal de Itajubá
Yuyi Lin P.E., University of Missouri; Xiuting Wei, Shandong University of Technology; Lanmei Wang, Shandong University of Technology; Yanfei Zhang, Shandong University of Technology; Wenqiang Yu P.E., Shandong University of Technology; Yufeng Sun, Shandong University of Technology
Shayne Kelly McConomy, Florida A&M University/Florida State University; Ruturaj Soman; Nikhil Gupta, Florida A&M University/Florida State University; Chiang Shih, Florida A&M University/Florida State University
Andy S. Peng, University of Wisconsin - Stout; Brian Eickhoff, Sentera, LLC; Kenan Baltaci, University of Wisconsin - Stout; Liang Zhan, University of Wisconsin - Stout; Robert M. Nelson, University of Wisconsin - Stout
Lisa M. Del Torto, Northwestern University; Bruce Ankenman, Northwestern University; Stacy Benjamin, Northwestern University; Trevor Harty, Northwestern University; Penny L. Hirsch, Northwestern University
Nikhil Gupta, Florida State University; Matthew J Jensen, Florida Institute of Technology; Chiang Shih, Florida A&M University/Florida State University
Jheng-Wun Su, University of Missouri; Zhengwei Nie, University of Missouri; Jiamin Wang, University of Missouri - Columbia; Yuyi Lin P.E., University of Missouri