John M Robertson, Arizona State University, Polytechnic campus; Kathleen Meehan, Virginia Tech; Robert John Bowman, Rochester Institute of Technology (COE); Kenneth A Connor, Rensselaer Polytechnic Institute; Douglas A Mercer, Analog Devices Inc.
Karl L Wang, Department of Engineering Harvey Mudd College 301 Platt Boulevard Clarement, CA 91711 909-607-9136 ; Clint S Cole, Digilent, Inc.; Tinghui Wang, Digilent Inc; Joe Harris, Digilent, Inc.
Eric Freudenthal, University of Texas, El Paso; Rebeca Gonzalez, Chapin High School; Sarah Hug, University of Colorado; Alexandria Ogrey, University of Texas, El Paso; Mary Kay Roy, University of Texas, El Paso; Alan Siegel, NYU
Gordon Skelton, Jackson State University; Wei Zheng, Jackson State University; HuiRu Shih, Jackson State University; Evelyn Leggette, Jackson State University; Tzusheng Pei, Jackson State University
Paul G. Flikkema, Northern Arizona University; Kenji Ryan Yamamoto, Northern Arizona University; Carol Haden, Magnolia Consulting, LLC; Jeff Frolik, University of Vermont; Tom Weller, University of South Florida
Mihaela Radu, Rose-Hulman Institute of Technology; Clint S. Cole, Digilent, Inc.; Joe Harris, Digilent, Inc.; Mircea Dabacan, Technical University of Cluj-Napoca
Dale S.L. Dolan, California Polytechnic State University; Vladimir I. Prodanov, California Polytechnic State University, San Luis Obispo; Taufik Taufik, California Polytechnic State University
David Jakob Fritz, Oklahoma State University; Wira Mulia, Oklahoma State University; Sohum Sohoni, Oklahoma State University; Kerri S. Kearney, Oklahoma State University; Mwarumba Mwavita, Oklahoma State University
Kenneth A. Connor, Rensselaer Polytechnic Institute; Frederick C Berry, Milwaukee School of Engineering; Mohamed F. Chouikha, Howard University; Dianna Newman, University at Albany/SUNY; Meghan Morris Deyoe, The Evaluation Consortium; Gavin Anaya; William Brubaker, Rensselaer Polytechnic Institute
Patrick Kane, Cypress Semiconductor Corp.; Alexander Ganago, University of Michigan; Robert F. Giles, University of Michigan; Hongwei Liao, University of Michigan, Ann Arbor