Pre-College Engineering Education Division (PCEE) Technical Session 6: Engineering in the Home
Collection
2023 ASEE Annual Conference & Exposition
Authors
Kelli Paul, Indiana University-Bloomington; Lauren Penney, Indiana University-Bloomington; Adam Maltese, Indiana University-Bloomington; Amber Simpson, State University of New York at Binghamton; Jungsun Kim, Indiana University-Bloomington
Pre-College Engineering Education Division (PCEE) Technical Session 6: Engineering in the Home
Collection
2023 ASEE Annual Conference & Exposition
Authors
Catherine Wagner, University of Notre Dame; Gina Navoa Svarovsky, University of Notre Dame; Mia Lettau, University of Notre Dame; Kimberly Marfo; Andrea Lorena Ortiz, Pontificia Universidad Católica de Chile; Delaney Ryan; Scott A. Pattison; Smirla Ramos-Montañez; Viviana López Burgos; Sabrina De Los Santos Rodríguez; Maria D. Quijano; Amy R Corbett
Pre-College Engineering Education Division (PCEE) Technical Session 6: Engineering in the Home
Collection
2023 ASEE Annual Conference & Exposition
Authors
Jubie Tan, State University of New York at Binghamton; Amber Simpson, State University of New York at Binghamton; Peter N. Knox, University of Vermont; Sawsan Werfelli, State University of New York at Binghamton; Adam Maltese, Indiana University-Bloomington
Mr. Burns' Brainchild: AI in the Springfield STEM Classroom, Release the Hounds!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Geling Xu, Tufts Center for Engineering Education and Outreach; Milan Dahal, Tufts Center for Engineering Education and Outreach; Brian Gravel, Tufts University
Mr. Burns' Brainchild: AI in the Springfield STEM Classroom, Release the Hounds!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Alvin Talmadge Hughes IV, University of Florida; Jacob Casey Yarick, University of Florida; Nancy Ruzycki, University of Florida; Hajymyrat Serdarovich Geldimuradov, University of Florida; Sarah Louise Langham, University of Florida; Katherine Miller, University of Florida
Mr. Burns' Brainchild: AI in the Springfield STEM Classroom, Release the Hounds!
Collection
2024 ASEE Annual Conference & Exposition
Authors
S. Shailja, University of California, Santa Barbara; Satish Kumar, University of California, Santa Barbara; Arthur Caetano, University of California, Santa Barbara; Ayush Pandey, University of California, Merced
Dayna L. Martínez, Society of Hispanic Professional Engineers, Inc.; Esther Gonzalez; Deanna Drako; Andrea D. Beattie; Ashleigh Tierney; Enrique Guzman; Kimberly D Douglas P.E., Society of Hispanic Professional Engineers, Inc.
Bart's Big Plan: Engaging High Schoolers in Engineering Adventures ... Ay Caramba!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Per G. Norstrom, Royal Institute of Technology (KTH); Charlotta Nordlöf, Linkoping University; Konrad J. Schönborn; Jonas Hallström, Linkoping University
Bart's Big Plan: Engaging High Schoolers in Engineering Adventures ... Ay Caramba!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Allison Antink-Meyer, Illinois State University; Jeritt Williams, Illinois State University; Matthew Aldeman, Illinois State University; Jin Ho Jo, Illinois State University
Duff's Dynamic Duo: Harnessing the Power of Teamwork for STEM Excellence!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Cristina Diordieva, Nanyang Technological University; Adeel Khalid, Kennesaw State University; Sohini Gupta, Wheeler High School; Ibrahim H. Yeter, Nanyang Technological University
Duff's Dynamic Duo: Harnessing the Power of Teamwork for STEM Excellence!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Joshua D. Carl, Milwaukee School of Engineering; Amii LaPointe, Milwaukee School of Engineering; Cindy Miller, Milwaukee School of Engineering; Cory J. Prust, Milwaukee School of Engineering; Elizabeth Taylor, Milwaukee School of Engineering
Meltem Alemdar, Georgia Institute of Technology; Dyanne Baptiste Porter, Georgia Institute of Technology; Abeera P. Rehmat, Georgia Institute of Technology; Michael Helms; Alexandra A. Towner, Georgia Institute of Technology; Roxanne Moore, Georgia Institute of Technology; Jeffrey H Rosen, Georgia Institute of Technology; Julia Varnedoe; Marc Weissburg
Christine M Cunningham, Pennsylvania State University; Gregory John Kelly, Pennsylvania State University; Ashwin Krishnan Mohan, Pennsylvania State University
Azizi Penn, Purdue University; Rachel E. Gehr, Purdue University at West Lafayette (PPI); Hillary E. Merzdorf, Texas A&M University; Siddika Selcen Guzey, Purdue University at West Lafayette (COE); Morgan M Hynes, Purdue University at West Lafayette (COE); Kerrie A Douglas, Purdue University at West Lafayette (COE); Tamara J Moore, Purdue University at West Lafayette (COE)
Emanuel Joseph Louime; Eunice Yujin Kang; Emma Anderson, Massachusetts Institute of Technology; Kristin A Searle, Utah State University; Avneet Hira, Boston College
Elizabeth Meintel, University of Cincinnati; Samieh Askarian Khanamani, University of Cincinnati; Blaire MH Bartish M.Ed., University of Cincinnati; Whitney Gaskins, University of Cincinnati; Kyle Turner, University of Cincinnati
Jose Capa Salinas, Purdue University; Manuel Salmeron, Purdue University; Gaurav Chobe, Purdue University; Herta Montoya, Purdue University at West Lafayette (COE); Morgan R Broberg, Purdue University at West Lafayette (COE)
Meltem Alemdar, Georgia Institute of Technology; Sunni Haag Newton, Georgia Institute of Technology; Jessica D Gale, Georgia Institute of Technology; Talia Capozzoli Kessler, Georgia Institute of Technology; Roxanne Moore, Georgia Institute of Technology
Krusty's Creations: Robotics and Electronics in Springfield STEAM, Hey Hey!
Collection
2024 ASEE Annual Conference & Exposition
Authors
Shauna Adams, Purdue University; Cristian Eduardo Vargas-Ordonez P.E., Purdue University; Morgan M Hynes, Purdue University; Kerrie A Douglas, Purdue University; Peter Bermel, Purdue University; David R. Ely, Ivy Tech Community College, Indianapolis; Hayley Joy Grisez